Silicon wafer polishing machine
- Automotive
- Aerospace
- General machining
- Shipbuilding
- Heavy electric
- Material
- Semiconductor
- Specialized machines
Mirror finishing machine for silicon wafers
Original operation system from ingot delivery to cutting and unloading
Features
1Workpiece: Silicon wafer
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- Spindle power (kW)
- 5.5
- Work size (mm)
- Max Φ320 x 2,000
Original operation system from ingot delivery to cutting and unloading
Silicon ingot bandsaw
Automatic silicon ingot cutting
- Spindle power (kW)
- 2.0
- Work size (mm)
- Max Φ320 x 2,800